Name: Three-Dimensional Field Solutions for Multi-Pole Cylindrical Halbach Arrays in an Axial Orientation (en Inglés)
Price: 483.13 MXN
Availability: InStock
Author: Nasa Technical Reports Server (Ntrs) ; Thompson, William K.
ISBN: 9781287236269

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portada Three-Dimensional Field Solutions for Multi-Pole Cylindrical Halbach Arrays in an Axial Orientation (en Inglés)

Formato

Libro Físico

Autor

Nasa Technical Reports Server (Ntrs)

William K. Thompson

Editorial

Bibliogov

Idioma

Inglés

N° páginas

Encuadernación

Tapa Blanda

Dimensiones

24.6 x 18.9 x 0.1 cm

Peso

0.07 kg.

ISBN13

9781287236269

Categorías

Política y gobierno

Three-Dimensional Field Solutions for Multi-Pole Cylindrical Halbach Arrays in an Axial Orientation (en Inglés)

Nasa Technical Reports Server (Ntrs) (Autor) · William K. Thompson (Autor) · Bibliogov · Tapa Blanda

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Reseña del libro "Three-Dimensional Field Solutions for Multi-Pole Cylindrical Halbach Arrays in an Axial Orientation (en Inglés)"

This article presents three-dimensional B field solutions for the cylindrical Halbach array in an axial orientation. This arrangement has applications in the design of axial motors and passive axial magnetic bearings and couplers. The analytical model described here assumes ideal magnets with fixed and uniform magnetization. The field component functions are expressed as sums of 2-D definite integrals that are easily computed by a number of mathematical analysis software packages. The analysis is verified with sample calculations and the results are compared to equivalent results from traditional finite-element analysis (FEA). The field solutions are then approximated for use in flux linkage and induced EMF calculations in nearby stator windings by expressing the field variance with angular displacement as pure sinusoidal function whose amplitude depends on radial and axial position. The primary advantage of numerical implementation of the analytical approach presented in the article is that it lends itself more readily to parametric analysis and design tradeoffs than traditional FEA models.